Mobile Phone PCB
name: Mobile Phone Board Layers: 6L HDI Thickness: 1.0mm Inner Min line width / distance: 0.1mm/0.1mm Outer Min line width / distance: 0.08mm/0.1mm Minimum laser hole: 0.1mm Minimum hole diameter: 0.2mm Impedance: 50 ohms, plus or minus 10% tolerance Fork points Impedance: 100 ohms, plus or minus 10% tolerance Minimum BGA solder joints: 0.23mm Surface treatment: OSP + Immersion Gold