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Tel:86-755-83416111
Fax:86-755-83416961
E-mail:sales@szektech.com
Add: Building 3,No.3,West Area,Shangxue Technology City,Bantian,Longgang District,Shenzhen,China
  • PCB Capability
  • Layer:1~22 layers

    Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg

    Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating

     

     

     

    English

    Metric

    1

    Max. Panel Size

     

    22" x 26"

    550 x 650mm

    2

    Mechanical Drill

     

     

     

     

    Min. Finished Holes Size

     

    0.004"

    0.10mm

     

    Finished Holes Tolerance

    PTH

    ±0.003"

    ±0.075mm

     

     

    NPTH

    ±0.002"

    ±0.050mm

     

     

    Press Fit

    ±0.002"

    ±0.050mm

     

    Aspect Ratio

     

    9 : 1

    9 : 1

    3

    Laser Drill

     

     

     

     

    Microvias diameter

     

    0.004" - 0.006"

    0.10 - 0.15mm

     

    Aspect Ratio

     

    1 : 1

    1 : 1

    4

    Min. Line Width/Spacing

    ½oz / 18um

    0.003" / 0.003"

    0.075 / 0.075mm

     

     

    1oz / 35um

    0.006" / 0.006"

    0.15 / 0.15mm

     

     

    2oz / 70um

    0.008" / 0.008"

    0.20 / 0.20mm

     

     

    3oz / 105um

    0.010" / 0.010"

    0.25 / 0.25mm

    5

    Registration

     

     

     

     

    Solder Mask

     

    ±0.003"

    ±0.075mm

     

    Layer to Layer

     

    ±0.0024"

    ±0.060mm

     

    Copper Feature to Holes(Outer)

     

    ±0.003"

    ±0.075mm

     

    Min. Plated Drills to Copper (inner)

    2L - 8L

    0.010"

    0.25mm

     

     

    10L -22L

    0.012"

    0.30mm

    6

    Board Outline

     

     

     

     

    Edge to Edge Tolerance

     

    ±0.004"

    ±0.10mm

     

    Holes to Edge Tolerance

     

    ±0.004"

    ±0.100mm

     

    Min. Copper to Edge distance

    Outer

    0.010"

    0.25mm

     

     

    Inner

    0.016"

    0.40mm

    7

    Max. Copper Thickness

     

    4oz

    140μm

    8

    Max. Board Thickness

     

    0.189"

    4.80 mm

    9

    Min Board Thickness

    2L

    0.008"

    0.20mm

     

     

    4L

    0.016"

    0.40mm

     

     

    6L -22L

    0.020"

    0.60mm

    10

    Min. Core Thickness

     

    0.004"

    0.10mm

    11

    Min. Soldermask Dam

    0.004"

    0.10mm

    12

    Controlled Impedance (Ohm)

    ±7% - 10%

    ±7% - 10%

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